The Schneider OTB1S0DM9LP is a versatile and compact I/O distributed module that forms part of the Modicon OTB series, renowned for its reliable performance in automation systems. This module is designed to facilitate the seamless integration and control of various input and output devices within a distributed control system.
Equipped with 12 inputs and 6 outputs, the module provides a mix of solid state and relay outputs to cater to a diverse range of applications. The inputs are of the EN/IEC 61131 type 1 standard, ensuring compatibility with a wide array of sensors and switches. The solid state outputs are PNP type, offering quick response times of 5 µs, making them suitable for high-speed operations.
The module's non-isolated serial link, with two RJ45 connectors in parallel, supports master/slave Modbus communication over an RS485 network, facilitating easy and efficient data exchange at speeds ranging from 1.2 to 38.4 kbit/s. This allows for flexible network topologies, including daisy-chaining or tap junctions, with a bus length of up to 10 metres and the possibility of connecting up to 32 devices per segment.
With an IP20 degree of protection, the OTB1S0DM9LP is designed for indoor use, providing immunity to microbreaks and a dielectric strength of 500 V between I/O and earth terminals, as well as between the power supply and earth. This ensures the module's resilience to electrical disturbances and enhances its operational reliability.
The module's compact dimensions of 90 x 84.6 x 55 mm make it an ideal choice for applications where space is at a premium, without compromising on functionality or performance. Its removable screw terminal block ensures ease of installation and maintenance, while the status LEDs for power, communication, and error indication provide immediate visual feedback on the module's operational status.
Overall, the Schneider OTB1S0DM9LP I/O distributed module is a robust and efficient solution for automating and controlling a wide range of industrial processes, offering reliability and flexibility in a compact form factor.